Nvidia and Amkor Technology have entered a multi-year agreement worth $1.5 billion to expand advanced semiconductor packaging and test capacity in the US, as the chip industry races to build out AI infrastructure.
Partnership Details
Under the agreement, Nvidia will make a prepayment to support the expansion of Amkor’s US advanced packaging operations, including capacity in Arizona. The companies will jointly develop packaging and testing technologies for Nvidia’s AI and accelerated-computing platforms, focusing on combining different types of chips in a single package.
Amkor already supplies advanced packaging for Nvidia’s product portfolio, including data center processors, and the expanded deal aims to bring new packaging technologies to market as AI infrastructure demand grows.
In June, Amkor entered a 10-year partnership with TSMC, the world’s largest contract chipmaker, to enhance semiconductor packaging capabilities in the United States. Amkor is also working with Advanced Micro Devices to package the semiconductor company’s chips.
Original reporting: Appleton, WI News Feed (HLL/CB) — read the source article.
