Huawei Technologies disclosed plans to introduce two new artificial‑intelligence chips in 2027. The company’s rotating chairman, David Wang, announced that the first chip, the 960DT, will be launched in the first quarter of 2027, followed by the Ascend 960PR in the third quarter.
UnifiedBus technology to power next‑generation AI systems
Wang highlighted Huawei’s UnifiedBus technology as a key component for the upcoming generation of large AI computing systems. The technology is designed to connect large numbers of chips, enabling them to work together efficiently.
Huawei has already shipped more than 1,000 AI computing systems to over 370 customers, demonstrating growing demand for its high‑performance solutions.
Implications for the AI hardware market
The new chips are expected to strengthen Huawei’s position in the global AI hardware market, where competition among major manufacturers is intensifying. By offering advanced connectivity and processing capabilities, Huawei aims to meet the needs of enterprises and developers seeking scalable AI infrastructure.
Industry observers note that Huawei’s continued investment in AI hardware reflects broader trends toward more powerful and integrated computing solutions, especially as AI applications expand across sectors such as cloud services, autonomous systems, and data analytics.
Original reporting: Appleton, WI News Feed (HLL/CB) — read the source article.
