Taiwan Semiconductor Manufacturing Co (TSMC) will add two advanced chip packaging plants in the Chiayi Science Park, according to Taiwan’s science and technology minister.
Expansion Plans
The Chiayi Science Park is being developed as one of TSMC’s major advanced chip-packaging hubs. TSMC’s first advanced chip packaging plant at the Chiayi Science Park has already entered mass production, and its second plant is expected to begin mass production soon.
The park is expected to generate more than 300 billion Taiwan dollars ($9.35 billion) in annual production value and create more than 9,000 jobs once all four plants are up and running. TSMC is rapidly expanding its advanced chip-packaging capacity, including its chip-on-wafer-on-substrate technology, as demand from artificial intelligence chip designers like Nvidia continues to outstrip supply.
Original reporting: Appleton, WI News Feed (HLL/CB) — read the source article.
