Samsung Electronics has struck a partnership with US chip designer Broadcom to widen cooperation across memory chips, contract chip making, and advanced packaging, expected to exceed $200 billion until 2030.
Partnership Details
The partnership will combine Broadcom’s expertise in designing application-specific integrated circuits (ASICs) with Samsung’s manufacturing capabilities. The deal provides for Broadcom’s next-generation communications chips to be made with Samsung’s sub-2-nanometre process technology.
The two companies will also collaborate on next-generation high-bandwidth memory (HBM) products. This partnership could help strengthen Samsung’s foundry business, as it seeks to narrow the gap with industry leader TSMC by wooing major technology customers.
Original reporting: Appleton, WI News Feed (HLL/CB) — read the source article.
