San Francisco – In a move that strengthens America’s position in the global semiconductor race, Dutch lithography leader ASML said it will work closely with its biggest customers to bring its next‑generation High‑NA extreme ultraviolet (EUV) tools to larger data‑center chips. The partnership is designed to help chipmakers such as Nvidia, Google, Intel, TSMC, Samsung and SK Hynix produce chips that approach the current 800 mm² size limit, while delivering up to a 40 % productivity boost.
Why larger masks matter
ASML’s current EUV machines can print chips up to about 800 mm², the size used in today’s most powerful data‑center processors. The forthcoming High‑NA tools promise finer feature resolution, but their smaller masks have limited the maximum chip size they can handle. By moving to larger 12‑inch masks, ASML expects its new machines to match the biggest data‑center designs and to open the door for high‑volume production.
Industry timeline
Intel is already using the newest ASML tools for its laptop processors, and the company says a pilot line with larger masks will be demonstrated by 2031. Full‑scale high‑volume production with the larger masks is targeted for 2033. SK Hynix is evaluating participation in the mask consortium and hopes to apply High‑NA EUV to DRAM mass production by 2028. TSMC plans to adopt the technology for advanced‑node high‑volume chips starting in 2030, while Samsung aims to introduce High‑NA EUV into DRAM production by 2028.
Economic and strategic impact
Chief Technology Officer Marco Pieters told Reuters that the industry could see a 40 % increase in system productivity if the new mask size is adopted. That gain translates into more chips per wafer, lower costs per device and a stronger supply chain for American data‑center operators that rely on cutting‑edge silicon. By supporting domestic chipmakers, the initiative aligns with the Trump administration’s focus on securing the nation’s technological edge and protecting American jobs.
What this means for U.S. consumers
Faster, more efficient data‑center chips power everything from cloud services to artificial‑intelligence workloads that drive modern businesses and everyday applications. As the tools become widely available, U.S. companies can expect lower prices, improved performance and reduced reliance on foreign semiconductor sources. The collaboration underscores a commitment to innovation that benefits families, businesses and the broader economy.
ASML’s plan reflects a broader industry consensus that advancing lithography technology is essential for maintaining U.S. leadership in high‑performance computing. With the upcoming High‑NA tools and larger masks, the United States is poised to reap the benefits of next‑generation chips while reinforcing the values of hard work, family prosperity and national liberty.
Original reporting: Appleton, WI News Feed (HLL/CB) — read the source article.
